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Solid State Technology - semiconductors, chips, integrated circuits
Latest News Technology Features Web Features Products
Ion beam deposition goes 300mm with Aviza's new tool
Nov 19 -
Aviza Technology exec David Butler explains the technology behind the StratIon fxP, the company's new 300mm-ready ion beam deposition system, and how it's better than traditional magnetron sputtering approaches in terms of film homogeneity, interface smoothness, and purity.
On display: Tech, strategy, glimpses at FPDI
Nov 18 -
Among the high-level takeaways from the recent FPDI displays event in Japan: Digital signage looks like the next "big" near-term market, Hollywood is pinning hopes on 3D technology, LCD TVs continue to improve thanks to backlight technology; and newer technologies (OLEDs, e-inks, R2R) are progressing but not yet ready.
WSTS chops chip estimates through 2010
Nov 18 -
Joining the rising chorus of industry watchers ratcheting down their forecasts, the World Semiconductor Trade Statistics (WSTS) says it sees semiconductor sales growth slowing to a crawl in 2008 -- and then crumbling into decline in 2009.
To 32nm and beyond: a design-manufacturing symbiosis
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At the 32nm node, technology enablers such as double-patterning, strain enhancement, advanced OPC, etc., require design for manufacturing (DFM) to support a design through manufacturing (D2M) methodology that is correct-by-construction.
Response surface methods for peak process performance
Nov 13 -
Response surface methods (RSM) provide statistically validated predictive models that can be manipulated for finding optimal process configurations that exhibit minimal variability. This article introduces two RSM enhancements that focus on achieving robust operating conditions.
45nm node registration metrology for EUV reticles
Nov 05 -
Tighter registration tolerances for the 45nm node and beyond require a next-generation registration metrology tool with capability to measure EUV masks with diverse substrate materials that might be used in 32nm and 22nm chip production.
HP optimizes low-cost processing for inkjet printheads
Aug 22 -
One of the most common and most ignored types of chips is on almost every desk in this electronic world of ours -- the inkjet printhead. This edition of Chip Forensics examines a three-color printhead device out of Hewlett Packard's low-cost HP 60 Tricolor ink cartridge launched earlier this year.
Two different approaches to integrated MEMS
May 07 -
by Dick James, Senior Technology Advisor, Chipworks
May 12, 2008 - After the 45nm hype of the last few months, let's go to the other end of the CMOS scale and examine some interesting MEMS devices that are leading the penetration into new markets like consumer electronics -- and would not have been manufacturable without the deep etching processes that have evolved over the last few years.
SST September 2007: Looking inside Apple's iPhone: Rad-hard technology?
Sep 04 -
EXECUTIVE OVERVIEW In this edition of Chip Forensics, Dick James tears down Apple's 8GB iPhone, and the reverse engineering of a Peregrine RF switch similar to the one used by Apple within it, to look at the unusual silicon-on-sapphire (SoS) process used for its manufacture.
Quotes delayed at least 20 mins.
GSA Awards Dinner Celebration
December 11 2008
Santa Clara, CA
SPIE Advanced Lithography
February 22-27 2009
San Jose, CA
Debra Vogler of Solid State Technology interviews Lars Liebmann, Distinguished Engineer, Design for Manufacturability at IBM, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Benjamin Eynon, Associate Director of Lithography, and Samsung assignee to SEMATECH, at the 2008 SPIE Advanced Lithography Conference. ; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Mireille Maenhoudt, Litho Process Development Group Manager at IMEC, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Franklin Kalk, CTO at Toppan Photomasks, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews John Sturtevant, RET Technology Support Manager at Mentor Graphics, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology; Debra Vogler of Solid State Technology interviews Christopher Sparkes, Sr. Director of Technology at Nikon Precision, at the 2008 SPIE Advanced Lithography Conference.; 193nm lithography; 22nm; CMOS manufacturing; Extreme Ultraviolet (EUV); Lithography; SST on the Scene at SPIE; double patterning; high-index immersion lithography; meeting overlay tolerances; nanoimprint lithography (NIL); solid state technology;
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